一 综合词汇

印制电路：printed circuit
印制线路：printed wiring
印制板：printed board
印制板电路：printed circuit board (PCB)
印制线路板：printed wiring board(PWB)
印制元件：printed component
印制接点：printed contact
印制板装配：printed board assembly
板：board
单面印制板：single-sided printed board(SSB)
双面印制板：double-sided printed board(DSB)
多层印制板：mulitlayer printed board(MLB)
多层印制电路板：mulitlayer printed circuit board
多层印制线路板：mulitlayer prited wiring board
刚性印制板：rigid printed board
刚性单面印制板：rigid single-sided printed borad
刚性双面印制板：rigid double-sided printed borad
刚性多层印制板：rigid multilayer printed board
挠性多层印制板：flexible multilayer printed board
挠性印制板：flexible printed board
挠性单面印制板：flexible single-sided printed board
挠性双面印制板：flexible double-sided printed board
挠性印制电路：flexible printed circuit (FPC)
挠性印制线路：flexible printed wiring
刚性印制板：flex-rigid printed board, rigid-flex printed board
刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
齐平印制板：flush printed board
金属芯印制板：metal core printed board
金属基印制板：metal base printed board
多重布线印制板：mulit-wiring printed board
陶瓷印制板：ceramic substrate printed board
导电胶印制板：electroconductive paste printed board
模塑电路板：molded circuit board
模压印制板：stamped printed wiring board
顺序层压多层印制板：sequentially-laminated mulitlayer
散线印制板：discrete wiring board
微线印制板：micro wire board
积层印制板：buile-up printed board
积层多层印制板：build-up mulitlayer printed board (BUM)
积层挠印制板：build-up flexible printed board
表面层合电路板：surface laminar circuit (SLC)
埋入凸块连印制板：B2it printed board
多层膜基板：multi-layered film substrate(MFS)
层间全内导通多层印制板：ALIVH multilayer printed board
载芯片板：chip on board (COB)
埋电阻板：buried resistance board
母板：mother board
子板：daughter board
背板：backplane
裸板：bare board
键盘板夹心板：copper-invar-copper board
动态挠性板：dynamic flex board
静态挠性板：static flex board
可断拼板：break-away planel
电缆：cable
挠性扁平电缆：flexible flat cable (FFC)
薄膜开关：membrane switch
混合电路：hybrid circuit
厚膜：thick film
厚膜电路：thick film circuit
薄膜：thin film
薄膜混合电路：thin film hybrid circuit
互连：interconnection
导线：conductor trace line
齐平导线：flush conductor
传输线：transmission line
跨交：crossover
板边插头：edge-board contact
增强板：stiffener
基底：substrate
基板面：real estate
导线面：conductor side
元件面：component side
焊接面：solder side
印制：printing
网格：grid
图形：pattern
导电图形：conductive pattern
非导电图形：non-conductive pattern
字符：legend
标志：mark

二 基材：

基材：base material
层压板：laminate
覆金属箔基材：metal-clad bade material
覆铜箔层压板：copper-clad laminate (CCL)
单面覆铜箔层压板：single-sided copper-clad laminate
双面覆铜箔层压板：double-sided copper-clad laminate
复合层压板：composite laminate
薄层压板：thin laminate
金属芯覆铜箔层压板：metal core copper-clad laminate
金属基覆铜层压板：metal base copper-clad laminate
挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
基体材料：basis material
预浸材料：prepreg
粘结片：bonding sheet
预浸粘结片：preimpregnated bonding sheer
环氧玻璃基板：epoxy glass substrate
加成法用层压板：laminate for additive process
预制内层覆箔板：mass lamination panel
内层芯板：core material
催化板材：catalyzed board ,coated catalyzed laminate
涂胶催化层压板：adhesive-coated catalyzed laminate
涂胶无催层压板：adhesive-coated uncatalyzed laminate
粘结层：bonding layer
粘结膜：film adhesive
涂胶粘剂绝缘薄膜：adhesive coated dielectric film
无支撑胶粘剂膜：unsupported adhesive film
覆盖层：cover layer (cover lay)
增强板材：stiffener material
铜箔面：copper-clad surface
去铜箔面：foil removal surface
层压板面：unclad laminate surface
基膜面：base film surface
胶粘剂面：adhesive faec
原始光洁面：plate finish
粗面：matt finish
纵向：length wise direction
模向：cross wise direction
剪切板：cut to size panel
酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
超薄型层压板：ultra thin laminate
陶瓷基覆铜箔板：ceramics base copper-clad laminates
紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

三 基材的材料

A阶树脂：A-stage resin
B阶树脂：B-stage resin
C阶树脂：C-stage resin
环氧树脂：epoxy resin
酚醛树脂：phenolic resin
聚酯树脂：polyester resin
聚酰亚胺树脂：polyimide resin
双马来酰亚胺三嗪树脂：bismaleimide-triazine resin
丙烯酸树脂：acrylic resin
三聚氰胺甲醛树脂：melamine formaldehyde resin
多官能环氧树脂：polyfunctional epoxy resin
溴化环氧树脂：brominated epoxy resin
环氧酚醛：epoxy novolac
氟树脂：fluroresin
硅树脂：silicone resin
硅烷：silane
聚合物：polymer
无定形聚合物：amorphous polymer
结晶现象：crystalline polamer
双晶现象：dimorphism
共聚物：copolymer
合成树脂：synthetic
热固性树脂：thermosetting resin
热塑性树脂：thermoplastic resin
感光性树脂：photosensitive resin
环氧当量：weight per epoxy equivalent (WPE)
环氧值：epoxy value
双氰胺：dicyandiamide
粘结剂：binder
胶粘剂：adesive
固化剂：curing agent
阻燃剂：flame retardant
遮光剂：opaquer
增塑剂：plasticizers
不饱和聚酯：unsatuiated polyester
聚酯薄膜：polyester
聚酰亚胺薄膜：polyimide film (PI)
聚四氟乙烯：polytetrafluoetylene (PTFE)
聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
增强材料：reinforcing material
玻璃纤维：glass fiber
E玻璃纤维：E-glass fibre
D玻璃纤维：D-glass fibre
S玻璃纤维：S-glass fibre
玻璃布：glass fabric
非织布：non-woven fabric
玻璃纤维垫：glass mats
纱线：yarn
单丝：filament
绞股：strand
纬纱：weft yarn
经纱：warp yarn
但尼尔：denier
经向：warp-wise
纬向：weft-wise, filling-wise
织物经纬密度：thread count
织物组织：weave structure
平纹组织：plain structure
坏布：grey fabric
稀松织物：woven scrim
弓纬：bow of weave
断经：end missing
缺纬：mis-picks
纬斜：bias
折痕：crease
云织：waviness
鱼眼：fish eye
毛圈长：feather length
厚薄段：mark
裂缝：split
捻度：twist of yarn
浸润剂含量：size content
浸润剂残留量：size residue
处理剂含量：finish level
浸润剂：size
偶联剂：couplint agent
处理织物：finished fabric
聚酰胺纤维：polyarmide fiber
聚酯纤维非织布：non-woven polyester fabric
浸渍绝缘纵纸：impregnating insulation paper
聚芳酰胺纤维纸：aromatic polyamide paper
断裂长：breaking length
吸水高度：height of capillary rise
湿强度保留率：wet strength retention
白度：whitenness
陶瓷：ceramics
导电箔：conductive foil
铜箔：copper foil
电解铜箔：electrodeposited copper foil (ED copper foil)
压延铜箔：rolled copper foil
退火铜箔：annealed copper foil
压延退火铜箔：rolled annealed copper foil (RA copper foil)
薄铜箔：thin copper foil
涂胶铜箔：adhesive coated foil
涂胶脂铜箔：resin coated copper foil (RCC)
复合金属箔：composite metallic material
载体箔：carrier foil
殷瓦：invar
箔（剖面）轮廓：foil profile
光面：shiny side
粗糙面：matte side
处理面：treated side
防锈处理：stain proofing
双面处理铜箔：double treated foil

四 设计

原理图：shematic diagram
逻辑图：logic diagram
印制线路布设：printed wire layout
布设总图：master drawing
可制造性设计：design-for-manufacturability
计算机辅助设计：computer-aided design.(CAD)
计算机辅助制造：computer-aided manufacturing.(CAM)
计算机集成制造：computer integrat manufacturing.(CIM)
计算机辅助工程：computer-aided engineering.(CAE)
计算机辅助测试：computer-aided test.(CAT)
电子设计自动化：electric design automation .(EDA)
工程设计自动化：engineering design automaton .(EDA2)
组装设计自动化：assembly aided architectural design. (AAAD)
计算机辅助制图：computer aided drawing
计算机控制显示：computer controlled display .(CCD)
布局：placement
布线：routing
布图设计：layout
重布：rerouting
模拟：simulation
逻辑模拟：logic simulation
电路模拟：circit simulation
时序模拟：timing simulation
模块化：modularization
布线完成率：layout effeciency
机器描述格式：machine descriptionm format .(MDF)
机器描述格式数据库：MDF databse
设计数据库：design database
设计原点：design origin
优化（设计）：optimization (design)
供设计优化坐标轴：predominant axis
表格原点：table origin
镜像：mirroring
驱动文件：drive file
中间文件：intermediate file
制造文件：manufacturing documentation
队列支撑数据库：queue support database
元件安置：component positioning
图形显示：graphics dispaly
比例因子：scaling factor
扫描填充：scan filling
矩形填充：rectangle filling
填充域：region filling
实体设计：physical design
逻辑设计：logic design
逻辑电路：logic circuit
层次设计：hierarchical design
自顶向下设计：top-down design
自底向上设计：bottom-up design
线网：net
数字化：digitzing
设计规则检查：design rule checking
走（布）线器：router (CAD)
网络表：net list
计算机辅助电路分析：computer-aided circuit analysis
子线网：subnet
目标函数：objective function
设计后处理：post design processing (PDP)
交互式制图设计：interactive drawing design
费用矩阵：cost metrix
工程图：engineering drawing
方块框图：block diagram
迷宫：moze
元件密度：component density
巡回售货员问题：traveling salesman problem
自由度：degrees freedom
入度：out going degree
出度：incoming degree
曼哈顿距离：manhatton distance
欧几里德距离：euclidean distance
网络：network
阵列：array
段：segment
逻辑：logic
逻辑设计自动化：logic design automation
分线：separated time
分层：separated layer
定顺序：definite sequence

五 形状与尺寸：

导线（通道）：conduction (track)
导线（体）宽度：conductor width
导线距离：conductor spacing
导线层：conductor layer
导线宽度/间距：conductor line/space
第一导线层：conductor layer No.1
圆形盘：round pad
方形盘：square pad
菱形盘：diamond pad
长方形焊盘：oblong pad
子弹形盘：bullet pad
泪滴盘：teardrop pad
雪人盘：snowman pad
V形盘：V-shaped pad
环形盘：annular pad
非圆形盘：non-circular pad
隔离盘：isolation pad
非功能连接盘：monfunctional pad
偏置连接盘：offset land
腹（背）裸盘：back-bard land
盘址：anchoring spaur
连接盘图形：land pattern
连接盘网格阵列：land grid array
孔环：annular ring
元件孔：component hole
安装孔：mounting hole
支撑孔：supported hole
非支撑孔：unsupported hole
导通孔：via
镀通孔：plated through hole (PTH)
余隙孔：access hole
盲孔：blind via (hole)
埋孔：buried via hole
埋/盲孔：buried /blind via
任意层内部导通孔：any layer inner via hole (ALIVH)
全部钻孔：all drilled hole
定位孔：toaling hole
无连接盘孔：landless hole
中间孔：interstitial hole
无连接盘导通孔：landless via hole
引导孔：pilot hole
端接全隙孔：terminal clearomee hole
准表面间镀覆孔：quasi-interfacing plated-through hole
准尺寸孔：dimensioned hole
在连接盘中导通孔：via-in-pad
孔位：hole location
孔密度：hole density
孔图：hole pattern
钻孔图：drill drawing
装配图：assembly drawing
印制板组装图：printed board assembly drawing
参考基准：datum referan